Air-filled cavity-backed 28 GHz Antenna array implemented by 2.5D PCB process and Network Analysis

H. Takahashi, S. W. Sattler, E. Schlaffer, B. Reitmaier, H. Sarbandifarahani, H. Paulitsch, W. Bösch

Research output: Chapter in Book/Report/Conference proceedingConference paperpeer-review


A 28 GHz air-filled cavity-backed microstrip antenna array, which is embedded in a polyphenyl ethers (PPE)-based multilayer printed circuit board (PCB), is presented. The air cavity is implemented by a novel 2.5D PCB process with a no-flow prepreg, to improve radiation efficiency, bandwidth, and directivity while maintaining a low profile. A four-element antenna array was designed, simulated, and measured. The measurement results yield a bandwidth of 3.8% centered at 28.5 GHz and a realized gain of 14.8 dBi with the antenna substrate thickness of 0.035λ0 and the separation of 0.8λ0 between elements. Network analysis for a single patch section of the designed antenna with transmission line (TL) models is discussed as well. The comparison between the analyzed, simulated, and measured input impedance shows a good agreement over the given frequency band.
Original languageEnglish
Title of host publication2021 51st European Microwave Conference (EuMC)
PublisherIEEE Xplore
Number of pages4
ISBN (Print)978-1-6654-4721-8
Publication statusPublished - 6 Apr 2022
Event51st European Microwave Conference: EuMC 2021 - London, United Kingdom
Duration: 4 Apr 20226 Apr 2022


Conference51st European Microwave Conference
Abbreviated titleEuMC 2021
Country/TerritoryUnited Kingdom
Internet address


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