Abstract
The paper presents a model-based controller design technique for a thermal process in silicon wafer manufacturing. The underlying model is obtained by dynamic mode decomposition which is a purely data-driven approach. The control scheme consists of a state feedback controller in combination with a disturbance observer, which allows robust tracking of feasible reference temperature profiles. The approach is validated using a laboratory setup.
| Original language | English |
|---|---|
| Title of host publication | 22nd IFAC World Congress |
| Place of Publication | Yokohama, Japan |
| Pages | 4234-4239 |
| Number of pages | 6 |
| Volume | 56 |
| Publication status | Published - 2023 |
| Event | 22nd IFAC World Congress: IFAC 2023 - Pacific Convention Plaza Yokohama, Yokohama, Japan Duration: 10 Jul 2023 → 14 Jul 2023 |
Conference
| Conference | 22nd IFAC World Congress |
|---|---|
| Abbreviated title | IFAC 2023 |
| Country/Territory | Japan |
| City | Yokohama |
| Period | 10/07/23 → 14/07/23 |
Keywords
- Thermal and process control applications of distributed parameter systems
- Data-driven robust control
- Model reduction