Investigation of Material Property Model on Substrate Deformation Induced by Thick-Walled WAAM Process Using Numerical Computation

Siti Nursyahirah Ahmad, Yupiter Harangan Prasada Manurung*, Muhd Faiz Mat, Martin Leitner

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference paperpeer-review


This research presents an investigation of material property model effects of thick-walled Wire Arc Additive Manufacturing (WAAM) process on deformation behaviour which involves thermo-mechanical non-linear numerical computation. A 3D thermo-elastic–plastic WAAM model is developed using general purposed FEA software MSC Marc/Mentat. The material models of component stainless steel SS316L were simulated based on two different sources namely material X5Crnimo18_10_1from default library database and evolved wire. The thermo-mechanical and thermo-physical material properties of evolved wire SS316L were obtained using chemical composition analysis SEDM-EDX and generated by advanced material modelling software. Component geometry was modelled using simplified rectangular shape and mesh which consists of ten layers and three strings. The numerical simulation was implemented under consideration of temperature dependent hardening rule with von-mises yield criteria and Goldak’s double ellipsoid heat source model was utilized. Based on the adjusted thermal coefficient parameters, the transient temperature distribution between two different material property models were analysed. The outcome of this research is to characterise the substrate deformation induced by WAAM process using material models of evolved component SS316L and existing material from default library database.

Original languageEnglish
Title of host publicationRecent Trends in Manufacturing and Materials Towards Industry 4.0 - Selected Articles from iM3F 2020, Malaysia
EditorsMuhammed Nafis Osman Zahid, Amiril Sahab Abdul Sani, Mohamad Rusydi Mohamad Yasin, Zulhelmi Ismail, Nurul Akmal Che Lah, Faiz Mohd Turan
PublisherSpringer Science and Business Media Deutschland GmbH
Number of pages15
ISBN (Print)9789811595042
Publication statusPublished - 2021
Externally publishedYes
Event2020 Innovative Manufacturing, Mechatronics and Materials Forum: iM3F 2020 - Virtuell, Malaysia
Duration: 6 Aug 20206 Aug 2020

Publication series

NameLecture Notes in Mechanical Engineering
ISSN (Print)2195-4356
ISSN (Electronic)2195-4364


Conference2020 Innovative Manufacturing, Mechatronics and Materials Forum
Abbreviated titleiM3F 2020


  • Deformation
  • Material modelling
  • Numerical computation
  • SS316L
  • WAAM

ASJC Scopus subject areas

  • Automotive Engineering
  • Aerospace Engineering
  • Mechanical Engineering
  • Fluid Flow and Transfer Processes


Dive into the research topics of 'Investigation of Material Property Model on Substrate Deformation Induced by Thick-Walled WAAM Process Using Numerical Computation'. Together they form a unique fingerprint.

Cite this