Microstructure characterisation of multi-principal element alloys welds produced by electron beam welding

Ricardo Henrique Buzolin*, Tim Richter, Florian Pixner, Michael Rhode, Dirk Schroepfer, Norbert Enzinger

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

This work explores the feasibility of producing bead-on-plate welds of a CrCoNi medium entropy alloy and a CrMnFeCoNi high entropy alloy using electron beam welding. The alloys were welded in two states: one in an as-cold-rolled condition and the other in an annealed condition. In addition, the materials are welded with two different parameters. The FCC microstructure of the welds is investigated using scanning electron microscopy assisted by energy-dispersive X-ray spectroscopy and electron-backscattered diffraction. The impact of the weld on the microstructure is discussed. The heat-affected zone is negligible for the annealed condition of both medium and high entropy alloys since there is no driving force for recrystallisation and the exposure time to high temperature is insufficient for grain coarsening. The texture formed in the fusion zone is also discussed and compared to the texture in the base metal and the heat-affected zone. Although the grain growth along the 〈1 0 0〉 crystallographic direction is preferential in all cases, the crystallographic texture type differs from each weld. Higher hardness values are measured in the medium entropy alloy's base metal and fusion zone than in the high entropy alloy.

Original languageEnglish
Article number111609
JournalMaterials & Design
Volume225
DOIs
Publication statusPublished - Jan 2023

Keywords

  • Electron backscattered diffraction (EBSD)
  • Electron beam welding (EBW)
  • High entropy alloys (HEA)
  • Medium entropy alloys (MEA)
  • Microstructure
  • Multi-principal element alloys

ASJC Scopus subject areas

  • Mechanics of Materials
  • Mechanical Engineering
  • General Materials Science

Fields of Expertise

  • Advanced Materials Science

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