Abstract
The main objective of this paper is to demonstrate the implementation of different dynamic stress test methods within a unified stress test apparatus by retaining most of the functional modules constant and merely changing the Device Under Test (DUT) for a variety of power devices and stress patterns. A prototype has been constructed which is capable of implementing Short Circuit (SC) and Unclamped Inductive Switching (UIS), as well as Double Pulse (DP) testing for stressing power semiconductor devices of different voltage and current classes. Last but not least, a protection circuit has been incorporated to safely turn off the power circuit in case of DUT failure.
Original language | English |
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Article number | 113852 |
Journal | Microelectronics Reliability |
Volume | 114 |
DOIs | |
Publication status | Published - Nov 2020 |
Keywords
- Double pulse
- Dynamic pulse stressing
- Modular system
- Short circuit
- Unclamped inductive switching
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Atomic and Molecular Physics, and Optics
- Safety, Risk, Reliability and Quality
- Condensed Matter Physics
- Surfaces, Coatings and Films
- Electrical and Electronic Engineering