Thermomechanical model of an oxide-confined GaAs-based VCSEL emitter

R. A. Coppeta*, R. Fabbro, Michael Pusterhofer, T. Haber, G. Fasching

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

A thermomechanical model for an oxide-confined GaAs-based VCSEL emitter is presented. The impact of the lattice mismatch, the oxide shrinkage and the thermal stress on the mechanical reliability is evaluated. Under standard operating conditions, calculations show that the temperature increase has a negligible influence on the overall mechanical stress. The oxide shrinkage highly deforms the epitaxial structure at the edge of the optical aperture. At oxide corners, the calculated stress is beyond the experimental yield strength of GaAs micro-pillars, enabling the nucleation of the dislocations forming dark line defects. The high misfit stress in the quantum well layers can favor there the dislocation propagation.

Original languageEnglish
Article number114828
JournalMicroelectronics Reliability
Volume140
DOIs
Publication statusPublished - Jan 2023

Keywords

  • Dark line defects
  • Lattice mismatch
  • Oxide shrinkage
  • Thermal stress
  • VCSEL

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Safety, Risk, Reliability and Quality
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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