Abstract
This paper investigates the bandwidth extension achieved for a Doherty power amplifier topology, by using a packaging approach which minimizes packaging-related parasitic effects, such as the effective inductance of bonding wires. A Doherty power amplifier module is designed using a novel packaging approach by embedding the higher power RF transistors inside the module laminate. This embedded approach is compared against a more conventional previously developed demonstrator, which uses wire-bonded transistor dies. Initial simulations show that the embedded Doherty amplifier can extend the bandwidth from the initial 500 MHz to 800 MHz, while maintaining similar levels of output power, drain efficiency and transducer gain. Finally, the measured performance of the embedded and wire-bonded demonstrators is also analyzed and compared.
Originalsprache | englisch |
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Titel | 2023 IEEE/MTT-S International Microwave Symposium - IMS 2023 |
Herausgeber (Verlag) | ACM/IEEE |
Seiten | 454-457 |
Seitenumfang | 4 |
ISBN (elektronisch) | 9798350347647 |
ISBN (Print) | 979-8-3503-4765-4 |
DOIs | |
Publikationsstatus | Veröffentlicht - 16 Juni 2023 |
Veranstaltung | IEEE International Microwave Symposium 2023: IMS 2023 - San Diego, USA / Vereinigte Staaten Dauer: 11 Juni 2023 → 16 Juni 2023 https://ims-ieee.org/ |
Publikationsreihe
Name | IEEE MTT-S International Microwave Symposium Digest |
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Band | 2023-June |
ISSN (Print) | 0149-645X |
Konferenz
Konferenz | IEEE International Microwave Symposium 2023 |
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Land/Gebiet | USA / Vereinigte Staaten |
Ort | San Diego |
Zeitraum | 11/06/23 → 16/06/23 |
Internetadresse |
ASJC Scopus subject areas
- Physik der kondensierten Materie
- Strahlung
- Elektrotechnik und Elektronik