Bandwidth Extension of a Doherty Power Amplifier Through Reduction of Packaging-Related Parasitic Effects

Ioannis Peppas; Hiroaki Takahashi; Sebastian Sattler; Markus Kastelic; Erich Schlaffer; Helmut Paulitsch; Wolfgang Bösch

doi:10.1109/IMS37964.2023.10188023

Bandwidth Extension of a Doherty Power Amplifier Through Reduction of Packaging-Related Parasitic Effects

Ioannis Peppas, Hiroaki Takahashi, Sebastian Sattler, Markus Kastelic, Erich Schlaffer, Helmut Paulitsch, Wolfgang Bösch

Institute of Microwave and Photonic Engineering (4510)

Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review

Abstract

This paper investigates the bandwidth extension achieved for a Doherty power amplifier topology, by using a packaging approach which minimizes packaging-related parasitic effects, such as the effective inductance of bonding wires. A Doherty power amplifier module is designed using a novel packaging approach by embedding the higher power RF transistors inside the module laminate. This embedded approach is compared against a more conventional previously developed demonstrator, which uses wire-bonded transistor dies. Initial simulations show that the embedded Doherty amplifier can extend the bandwidth from the initial 500 MHz to 800 MHz, while maintaining similar levels of output power, drain efficiency and transducer gain. Finally, the measured performance of the embedded and wire-bonded demonstrators is also analyzed and compared.

Original language	English
Title of host publication	2023 IEEE/MTT-S International Microwave Symposium - IMS 2023
Publisher	ACM/IEEE
Pages	454-457
Number of pages	4
ISBN (Electronic)	9798350347647
ISBN (Print)	979-8-3503-4765-4
DOIs	https://doi.org/10.1109/IMS37964.2023.10188023
Publication status	Published - 16 Jun 2023
Event	2023 IEEE/MTT-S International Microwave Symposium: IMS 2023 - San Diego, United States Duration: 11 Jun 2023 → 16 Jun 2023 https://ims-ieee.org/

Publication series

Name	IEEE MTT-S International Microwave Symposium Digest
Volume	2023-June
ISSN (Print)	0149-645X

Conference

Conference	2023 IEEE/MTT-S International Microwave Symposium
Country/Territory	United States
City	San Diego
Period	11/06/23 → 16/06/23
Internet address	https://ims-ieee.org/

Keywords

Radio frequency
Transducers
Wires
Power amplifiers
Bandwidth
Packaging
Topology
packaging
microwave amplifiers
component embedding
Doherty amplifiers
RF amplifiers
GaN-HEMT

ASJC Scopus subject areas

Condensed Matter Physics
Radiation
Electrical and Electronic Engineering

Access to Document

10.1109/IMS37964.2023.10188023

Cite this

Peppas, I., Takahashi, H., Sattler, S., Kastelic, M., Schlaffer, E., Paulitsch, H., & Bösch, W. (2023). Bandwidth Extension of a Doherty Power Amplifier Through Reduction of Packaging-Related Parasitic Effects. In 2023 IEEE/MTT-S International Microwave Symposium - IMS 2023 (pp. 454-457). Article 10188023 (IEEE MTT-S International Microwave Symposium Digest; Vol. 2023-June). ACM/IEEE. https://doi.org/10.1109/IMS37964.2023.10188023

Bandwidth Extension of a Doherty Power Amplifier Through Reduction of Packaging-Related Parasitic Effects. / Peppas, Ioannis; Takahashi, Hiroaki; Sattler, Sebastian et al.
2023 IEEE/MTT-S International Microwave Symposium - IMS 2023. ACM/IEEE, 2023. p. 454-457 10188023 (IEEE MTT-S International Microwave Symposium Digest; Vol. 2023-June).

Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review

Peppas, I, Takahashi, H, Sattler, S, Kastelic, M, Schlaffer, E, Paulitsch, H & Bösch, W 2023, Bandwidth Extension of a Doherty Power Amplifier Through Reduction of Packaging-Related Parasitic Effects. in 2023 IEEE/MTT-S International Microwave Symposium - IMS 2023., 10188023, IEEE MTT-S International Microwave Symposium Digest, vol. 2023-June, ACM/IEEE, pp. 454-457, 2023 IEEE/MTT-S International Microwave Symposium, San Diego, California, United States, 11/06/23. https://doi.org/10.1109/IMS37964.2023.10188023

Peppas I, Takahashi H, Sattler S, Kastelic M, Schlaffer E, Paulitsch H et al. Bandwidth Extension of a Doherty Power Amplifier Through Reduction of Packaging-Related Parasitic Effects. In 2023 IEEE/MTT-S International Microwave Symposium - IMS 2023. ACM/IEEE. 2023. p. 454-457. 10188023. (IEEE MTT-S International Microwave Symposium Digest). doi: 10.1109/IMS37964.2023.10188023

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abstract = "This paper investigates the bandwidth extension achieved for a Doherty power amplifier topology, by using a packaging approach which minimizes packaging-related parasitic effects, such as the effective inductance of bonding wires. A Doherty power amplifier module is designed using a novel packaging approach by embedding the higher power RF transistors inside the module laminate. This embedded approach is compared against a more conventional previously developed demonstrator, which uses wire-bonded transistor dies. Initial simulations show that the embedded Doherty amplifier can extend the bandwidth from the initial 500 MHz to 800 MHz, while maintaining similar levels of output power, drain efficiency and transducer gain. Finally, the measured performance of the embedded and wire-bonded demonstrators is also analyzed and compared.",

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Bandwidth Extension of a Doherty Power Amplifier Through Reduction of Packaging-Related Parasitic Effects

Abstract

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Keywords

ASJC Scopus subject areas

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