Broadband Characterization of Co-planar GSG Wirebonds for RF Heterogeneous 2.5D Integration

Ziad Hatab; Erich Leitgeb; Michael E. Gadringer

doi:10.1109/ARFTG52261.2021.9640137

Broadband Characterization of Co-planar GSG Wirebonds for RF Heterogeneous 2.5D Integration

Ziad Hatab, Erich Leitgeb, Michael E. Gadringer

Institut für Hochfrequenztechnik (4510)

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in einem Konferenzband › Begutachtung

Abstract

With the advancement in silicon interposer teehnol- ogy and Through Silicon Vias (TSVs) [1], [2], heterogeneous 2.5D integration at mm-wave frequencies is becoming more approachable than ever. In this work, we investigated co-planer Ground- Signal-Ground (GSG) wirebonds as cost-effective interconnect for RF 2.5D applications. On-silicon GSG wirebonds of 25μm diameter and 100μm pitch were realized and measured at different lengths and at frequencies up to 40 GHz. Circuit modeling of the measurements showed excellent agreement. Additionally, GSG wirebonds with lengths below 500μm achieved insertion loss below 2dB up to 40GHz, while still leaving room for improvements, e.g., by reducing bond pitch or deploying ribbon bonds.

Originalsprache	englisch
Titel	97th ARFTG Microwave Measurement Conference
Untertitel	Conducted and Ota Measurement Challenges for Urban, Rural and SatComm Connectivity, ARFTG 2021
Herausgeber (Verlag)	IEEE Publications
Seiten	1-4
Seitenumfang	4
ISBN (elektronisch)	9780738112480
ISBN (Print)	978-1-6654-4794-2
DOIs	https://doi.org/10.1109/ARFTG52261.2021.9640137
Publikationsstatus	Veröffentlicht - 25 Juni 2021
Veranstaltung	97th ARFTG Microwave Measurement Conference: Conducted and Ota Measurement Challenges for Urban, Rural and SatComm Connectivity: ARFTG 2021 - Virtual, Atlanta, USA / Vereinigte Staaten Dauer: 25 Juni 2021 → 25 Juni 2021

Publikationsreihe

Name	97th ARFTG Microwave Measurement Conference: Conducted and Ota Measurement Challenges for Urban, Rural and SatComm Connectivity, ARFTG 2021

Konferenz

Konferenz	97th ARFTG Microwave Measurement Conference: Conducted and Ota Measurement Challenges for Urban, Rural and SatComm Connectivity
Kurztitel	ARFTG 2021
Land/Gebiet	USA / Vereinigte Staaten
Ort	Virtual, Atlanta
Zeitraum	25/06/21 → 25/06/21

Schlagwörter

Radio frequency
Microwave measurement
Integrated circuit interconnections
Insertion loss
Length measurement
Silicon
Frequency measurement

ASJC Scopus subject areas

Instrumentierung
Elektrotechnik und Elektronik
Computernetzwerke und -kommunikation

Fields of Expertise

Information, Communication & Computing

Treatment code (Nähere Zuordnung)

Experimental

Zugriff auf Dokument

10.1109/ARFTG52261.2021.9640137

https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9640137

Andere Dateien und Links

Verknüpfung zur Publikation in Scopus

TRITON - Heterogene Integration von Millimeter-Wellen Technologie
Gadringer, M. E., Romero Lopera, J., Bösch, W., Pezzei, P., Leitgeb, E., Hatab, Z. & Bekhrad, P.
1/05/17 → 30/04/21
Projekt: Forschungsprojekt

Dieses zitieren

Hatab, Z., Leitgeb, E., & Gadringer, M. E. (2021). Broadband Characterization of Co-planar GSG Wirebonds for RF Heterogeneous 2.5D Integration. in 97th ARFTG Microwave Measurement Conference: Conducted and Ota Measurement Challenges for Urban, Rural and SatComm Connectivity, ARFTG 2021 (S. 1-4). Artikel 9640137 (97th ARFTG Microwave Measurement Conference: Conducted and Ota Measurement Challenges for Urban, Rural and SatComm Connectivity, ARFTG 2021). IEEE Publications. https://doi.org/10.1109/ARFTG52261.2021.9640137

Broadband Characterization of Co-planar GSG Wirebonds for RF Heterogeneous 2.5D Integration. / Hatab, Ziad; Leitgeb, Erich ; Gadringer, Michael E.
97th ARFTG Microwave Measurement Conference: Conducted and Ota Measurement Challenges for Urban, Rural and SatComm Connectivity, ARFTG 2021. IEEE Publications, 2021. S. 1-4 9640137 (97th ARFTG Microwave Measurement Conference: Conducted and Ota Measurement Challenges for Urban, Rural and SatComm Connectivity, ARFTG 2021).

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in einem Konferenzband › Begutachtung

Hatab, Z, Leitgeb, E & Gadringer, ME 2021, Broadband Characterization of Co-planar GSG Wirebonds for RF Heterogeneous 2.5D Integration. in 97th ARFTG Microwave Measurement Conference: Conducted and Ota Measurement Challenges for Urban, Rural and SatComm Connectivity, ARFTG 2021., 9640137, 97th ARFTG Microwave Measurement Conference: Conducted and Ota Measurement Challenges for Urban, Rural and SatComm Connectivity, ARFTG 2021, IEEE Publications, S. 1-4, 97th ARFTG Microwave Measurement Conference: Conducted and Ota Measurement Challenges for Urban, Rural and SatComm Connectivity, Virtual, Atlanta, Georgia, USA / Vereinigte Staaten, 25/06/21. https://doi.org/10.1109/ARFTG52261.2021.9640137

Hatab Z, Leitgeb E , Gadringer ME. Broadband Characterization of Co-planar GSG Wirebonds for RF Heterogeneous 2.5D Integration. in 97th ARFTG Microwave Measurement Conference: Conducted and Ota Measurement Challenges for Urban, Rural and SatComm Connectivity, ARFTG 2021. IEEE Publications. 2021. S. 1-4. 9640137. (97th ARFTG Microwave Measurement Conference: Conducted and Ota Measurement Challenges for Urban, Rural and SatComm Connectivity, ARFTG 2021). doi: 10.1109/ARFTG52261.2021.9640137

Hatab, Ziad ; Leitgeb, Erich ; Gadringer, Michael E. / Broadband Characterization of Co-planar GSG Wirebonds for RF Heterogeneous 2.5D Integration. 97th ARFTG Microwave Measurement Conference: Conducted and Ota Measurement Challenges for Urban, Rural and SatComm Connectivity, ARFTG 2021. IEEE Publications, 2021. S. 1-4 (97th ARFTG Microwave Measurement Conference: Conducted and Ota Measurement Challenges for Urban, Rural and SatComm Connectivity, ARFTG 2021).

@inproceedings{e8d077ec4fee4c4caca9dd24b505746e,

title = "Broadband Characterization of Co-planar GSG Wirebonds for RF Heterogeneous 2.5D Integration",

abstract = "With the advancement in silicon interposer technology and Through Silicon Vias (TSVs) [1], [2], heterogeneous 2.5D integration at mm-wave frequencies is becoming more approachable than ever. In this work, we investigated co-planer GroundSignal-Ground (GSG) wirebonds as cost-effective interconnect for RF 2.5D applications. On-silicon GSG wirebonds of 25p.m diameter and 100 p.m pitch were realized and measured at different lengths and at frequencies up to 40 GHz. Circuit modeling of the measurements showed excellent agrement. dditionally, GSG wirebonds with lengths below 500p.m achieved insertion loss below 2 dB up to 40 GHz, while still leaving room for improvements, e.g., by reducing bond pitch or deploying ribbon bonds.",

keywords = "Radio frequency, Microwave measurement, Integrated circuit interconnections, Insertion loss, Length measurement, Silicon, Frequency measurement, 2.5D integration, Circuit modeL, Interposer, Wirebond",

author = "Ziad Hatab and Erich Leitgeb and Gadringer, {Michael E.}",

year = "2021",

month = jun,

day = "25",

doi = "10.1109/ARFTG52261.2021.9640137",

language = "English",

isbn = "978-1-6654-4794-2",

series = "97th ARFTG Microwave Measurement Conference: Conducted and Ota Measurement Challenges for Urban, Rural and SatComm Connectivity, ARFTG 2021",

publisher = "IEEE Publications",

pages = "1--4",

booktitle = "97th ARFTG Microwave Measurement Conference",

note = "97th ARFTG Microwave Measurement Conference: Conducted and Ota Measurement Challenges for Urban, Rural and SatComm Connectivity : ARFTG 2021, ARFTG 2021 ; Conference date: 25-06-2021 Through 25-06-2021",

}

TY - GEN

T1 - Broadband Characterization of Co-planar GSG Wirebonds for RF Heterogeneous 2.5D Integration

AU - Hatab, Ziad

AU - Leitgeb, Erich

AU - Gadringer, Michael E.

PY - 2021/6/25

Y1 - 2021/6/25

N2 - With the advancement in silicon interposer technology and Through Silicon Vias (TSVs) [1], [2], heterogeneous 2.5D integration at mm-wave frequencies is becoming more approachable than ever. In this work, we investigated co-planer GroundSignal-Ground (GSG) wirebonds as cost-effective interconnect for RF 2.5D applications. On-silicon GSG wirebonds of 25p.m diameter and 100 p.m pitch were realized and measured at different lengths and at frequencies up to 40 GHz. Circuit modeling of the measurements showed excellent agrement. dditionally, GSG wirebonds with lengths below 500p.m achieved insertion loss below 2 dB up to 40 GHz, while still leaving room for improvements, e.g., by reducing bond pitch or deploying ribbon bonds.

AB - With the advancement in silicon interposer technology and Through Silicon Vias (TSVs) [1], [2], heterogeneous 2.5D integration at mm-wave frequencies is becoming more approachable than ever. In this work, we investigated co-planer GroundSignal-Ground (GSG) wirebonds as cost-effective interconnect for RF 2.5D applications. On-silicon GSG wirebonds of 25p.m diameter and 100 p.m pitch were realized and measured at different lengths and at frequencies up to 40 GHz. Circuit modeling of the measurements showed excellent agrement. dditionally, GSG wirebonds with lengths below 500p.m achieved insertion loss below 2 dB up to 40 GHz, while still leaving room for improvements, e.g., by reducing bond pitch or deploying ribbon bonds.

KW - Radio frequency

KW - Microwave measurement

KW - Integrated circuit interconnections

KW - Insertion loss

KW - Length measurement

KW - Silicon

KW - Frequency measurement

KW - 2.5D integration

KW - Circuit modeL

KW - Interposer

KW - Wirebond

UR - http://www.scopus.com/inward/record.url?scp=85123910865&partnerID=8YFLogxK

U2 - 10.1109/ARFTG52261.2021.9640137

DO - 10.1109/ARFTG52261.2021.9640137

M3 - Conference paper

SN - 978-1-6654-4794-2

T3 - 97th ARFTG Microwave Measurement Conference: Conducted and Ota Measurement Challenges for Urban, Rural and SatComm Connectivity, ARFTG 2021

SP - 1

EP - 4

BT - 97th ARFTG Microwave Measurement Conference

PB - IEEE Publications

T2 - 97th ARFTG Microwave Measurement Conference: Conducted and Ota Measurement Challenges for Urban, Rural and SatComm Connectivity

Y2 - 25 June 2021 through 25 June 2021

ER -

Broadband Characterization of Co-planar GSG Wirebonds for RF Heterogeneous 2.5D Integration

Abstract

Publikationsreihe

Konferenz

Schlagwörter

ASJC Scopus subject areas

Fields of Expertise

Treatment code (Nähere Zuordnung)

Zugriff auf Dokument

Andere Dateien und Links

Fingerprint

Projekte

TRITON - Heterogene Integration von Millimeter-Wellen Technologie

Dieses zitieren