Broadband Characterization of Co-planar GSG Wirebonds for RF Heterogeneous 2.5D Integration

Ziad Hatab; Erich Leitgeb; Michael E. Gadringer

doi:10.1109/ARFTG52261.2021.9640137

Broadband Characterization of Co-planar GSG Wirebonds for RF Heterogeneous 2.5D Integration

Ziad Hatab, Erich Leitgeb, Michael E. Gadringer

Institute of Microwave and Photonic Engineering (4510)

Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review

Abstract

With the advancement in silicon interposer technology and Through Silicon Vias (TSVs) [1], [2], heterogeneous 2.5D integration at mm-wave frequencies is becoming more approachable than ever. In this work, we investigated co-planer GroundSignal-Ground (GSG) wirebonds as cost-effective interconnect for RF 2.5D applications. On-silicon GSG wirebonds of 25p.m diameter and 100 p.m pitch were realized and measured at different lengths and at frequencies up to 40 GHz. Circuit modeling of the measurements showed excellent agrement. dditionally, GSG wirebonds with lengths below 500p.m achieved insertion loss below 2 dB up to 40 GHz, while still leaving room for improvements, e.g., by reducing bond pitch or deploying ribbon bonds.

Original language	English
Title of host publication	97th ARFTG Microwave Measurement Conference
Subtitle of host publication	Conducted and Ota Measurement Challenges for Urban, Rural and SatComm Connectivity, ARFTG 2021
Publisher	IEEE Publications
Pages	1-4
Number of pages	4
ISBN (Electronic)	9780738112480
ISBN (Print)	978-1-6654-4794-2
DOIs	https://doi.org/10.1109/ARFTG52261.2021.9640137
Publication status	Published - 25 Jun 2021
Event	97th ARFTG Microwave Measurement Conference: Conducted and Ota Measurement Challenges for Urban, Rural and SatComm Connectivity: ARFTG 2021 - Virtual, Atlanta, United States Duration: 25 Jun 2021 → 25 Jun 2021

Publication series

Name	97th ARFTG Microwave Measurement Conference: Conducted and Ota Measurement Challenges for Urban, Rural and SatComm Connectivity, ARFTG 2021

Conference

Conference	97th ARFTG Microwave Measurement Conference: Conducted and Ota Measurement Challenges for Urban, Rural and SatComm Connectivity
Abbreviated title	ARFTG 2021
Country/Territory	United States
City	Virtual, Atlanta
Period	25/06/21 → 25/06/21

Keywords

2.5D integration
Circuit modeL
Interposer
Wirebond

ASJC Scopus subject areas

Instrumentation
Electrical and Electronic Engineering
Computer Networks and Communications

Fields of Expertise

Information, Communication & Computing

Treatment code (Nähere Zuordnung)

Experimental

Access to Document

10.1109/ARFTG52261.2021.9640137

https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9640137

Cite this

Hatab, Z., Leitgeb, E., & Gadringer, M. E. (2021). Broadband Characterization of Co-planar GSG Wirebonds for RF Heterogeneous 2.5D Integration. In 97th ARFTG Microwave Measurement Conference: Conducted and Ota Measurement Challenges for Urban, Rural and SatComm Connectivity, ARFTG 2021 (pp. 1-4). [9640137] (97th ARFTG Microwave Measurement Conference: Conducted and Ota Measurement Challenges for Urban, Rural and SatComm Connectivity, ARFTG 2021). IEEE Publications. https://doi.org/10.1109/ARFTG52261.2021.9640137

Broadband Characterization of Co-planar GSG Wirebonds for RF Heterogeneous 2.5D Integration. / Hatab, Ziad ; Leitgeb, Erich ; Gadringer, Michael E.
97th ARFTG Microwave Measurement Conference: Conducted and Ota Measurement Challenges for Urban, Rural and SatComm Connectivity, ARFTG 2021. IEEE Publications, 2021. p. 1-4 9640137 (97th ARFTG Microwave Measurement Conference: Conducted and Ota Measurement Challenges for Urban, Rural and SatComm Connectivity, ARFTG 2021).

Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review

Hatab, Z , Leitgeb, E & Gadringer, ME 2021, Broadband Characterization of Co-planar GSG Wirebonds for RF Heterogeneous 2.5D Integration. in 97th ARFTG Microwave Measurement Conference: Conducted and Ota Measurement Challenges for Urban, Rural and SatComm Connectivity, ARFTG 2021., 9640137, 97th ARFTG Microwave Measurement Conference: Conducted and Ota Measurement Challenges for Urban, Rural and SatComm Connectivity, ARFTG 2021, IEEE Publications, pp. 1-4, 97th ARFTG Microwave Measurement Conference: Conducted and Ota Measurement Challenges for Urban, Rural and SatComm Connectivity, Virtual, Atlanta, Georgia, United States, 25/06/21. https://doi.org/10.1109/ARFTG52261.2021.9640137

Hatab Z , Leitgeb E , Gadringer ME. Broadband Characterization of Co-planar GSG Wirebonds for RF Heterogeneous 2.5D Integration. In 97th ARFTG Microwave Measurement Conference: Conducted and Ota Measurement Challenges for Urban, Rural and SatComm Connectivity, ARFTG 2021. IEEE Publications. 2021. p. 1-4. 9640137. (97th ARFTG Microwave Measurement Conference: Conducted and Ota Measurement Challenges for Urban, Rural and SatComm Connectivity, ARFTG 2021). doi: 10.1109/ARFTG52261.2021.9640137

Hatab, Ziad ; Leitgeb, Erich ; Gadringer, Michael E. / Broadband Characterization of Co-planar GSG Wirebonds for RF Heterogeneous 2.5D Integration. 97th ARFTG Microwave Measurement Conference: Conducted and Ota Measurement Challenges for Urban, Rural and SatComm Connectivity, ARFTG 2021. IEEE Publications, 2021. pp. 1-4 (97th ARFTG Microwave Measurement Conference: Conducted and Ota Measurement Challenges for Urban, Rural and SatComm Connectivity, ARFTG 2021).

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title = "Broadband Characterization of Co-planar GSG Wirebonds for RF Heterogeneous 2.5D Integration",

abstract = "With the advancement in silicon interposer technology and Through Silicon Vias (TSVs) [1], [2], heterogeneous 2.5D integration at mm-wave frequencies is becoming more approachable than ever. In this work, we investigated co-planer GroundSignal-Ground (GSG) wirebonds as cost-effective interconnect for RF 2.5D applications. On-silicon GSG wirebonds of 25p.m diameter and 100 p.m pitch were realized and measured at different lengths and at frequencies up to 40 GHz. Circuit modeling of the measurements showed excellent agrement. dditionally, GSG wirebonds with lengths below 500p.m achieved insertion loss below 2 dB up to 40 GHz, while still leaving room for improvements, e.g., by reducing bond pitch or deploying ribbon bonds.",

keywords = "Radio frequency, Microwave measurement, Integrated circuit interconnections, Insertion loss, Length measurement, Silicon, Frequency measurement, 2.5D integration, Circuit modeL, Interposer, Wirebond",

author = "Ziad Hatab and Erich Leitgeb and Gadringer, {Michael E.}",

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T1 - Broadband Characterization of Co-planar GSG Wirebonds for RF Heterogeneous 2.5D Integration

AU - Hatab, Ziad

AU - Leitgeb, Erich

AU - Gadringer, Michael E.

PY - 2021/6/25

Y1 - 2021/6/25

N2 - With the advancement in silicon interposer technology and Through Silicon Vias (TSVs) [1], [2], heterogeneous 2.5D integration at mm-wave frequencies is becoming more approachable than ever. In this work, we investigated co-planer GroundSignal-Ground (GSG) wirebonds as cost-effective interconnect for RF 2.5D applications. On-silicon GSG wirebonds of 25p.m diameter and 100 p.m pitch were realized and measured at different lengths and at frequencies up to 40 GHz. Circuit modeling of the measurements showed excellent agrement. dditionally, GSG wirebonds with lengths below 500p.m achieved insertion loss below 2 dB up to 40 GHz, while still leaving room for improvements, e.g., by reducing bond pitch or deploying ribbon bonds.

AB - With the advancement in silicon interposer technology and Through Silicon Vias (TSVs) [1], [2], heterogeneous 2.5D integration at mm-wave frequencies is becoming more approachable than ever. In this work, we investigated co-planer GroundSignal-Ground (GSG) wirebonds as cost-effective interconnect for RF 2.5D applications. On-silicon GSG wirebonds of 25p.m diameter and 100 p.m pitch were realized and measured at different lengths and at frequencies up to 40 GHz. Circuit modeling of the measurements showed excellent agrement. dditionally, GSG wirebonds with lengths below 500p.m achieved insertion loss below 2 dB up to 40 GHz, while still leaving room for improvements, e.g., by reducing bond pitch or deploying ribbon bonds.

KW - Radio frequency

KW - Microwave measurement

KW - Integrated circuit interconnections

KW - Insertion loss

KW - Length measurement

KW - Silicon

KW - Frequency measurement

KW - 2.5D integration

KW - Circuit modeL

KW - Interposer

KW - Wirebond

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DO - 10.1109/ARFTG52261.2021.9640137

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T3 - 97th ARFTG Microwave Measurement Conference: Conducted and Ota Measurement Challenges for Urban, Rural and SatComm Connectivity, ARFTG 2021

SP - 1

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BT - 97th ARFTG Microwave Measurement Conference

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Y2 - 25 June 2021 through 25 June 2021

ER -

Broadband Characterization of Co-planar GSG Wirebonds for RF Heterogeneous 2.5D Integration

Abstract

Publication series

Conference

Keywords

ASJC Scopus subject areas

Fields of Expertise

Treatment code (Nähere Zuordnung)

Access to Document

Other files and links

TRITON - Heterogeneous Integration of Millimeter-Wave Technology

Cite this

Broadband Characterization of Co-planar GSG Wirebonds for RF Heterogeneous 2.5D Integration

Abstract

Publication series

Conference

Keywords

ASJC Scopus subject areas

Fields of Expertise

Treatment code (Nähere Zuordnung)

Access to Document

Other files and links

Projects

TRITON - Heterogeneous Integration of Millimeter-Wave Technology

Cite this