Abstract
An analysis of hot-electron (HE) effects on the dynamic resistance ( ${dR}\,_{\mathrm{\scriptstyle ON}}$ ) of AlGaN/GaN high-electron-mobility transistors (HEMTs) when subject to semi-ON stress is reported and compared with OFF-state stress. This is carried out using measurements and TCAD 2-D hydrodynamic simulations. Two structures with different distances between the highly carbon-doped buffer region and the two-dimensional electron gas (2DEG) are here considered. The additional ${dR}\,_{\mathrm{\scriptstyle ON}}$ in semi-ON is attributed to HEs trapping at the passivation/AlGaN interface. TCAD simulations are performed and compared with experimental results.
Originalsprache | englisch |
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Aufsatznummer | 9214895 |
Seiten (von - bis) | 4602-4605 |
Seitenumfang | 4 |
Fachzeitschrift | IEEE Transactions on Electron Devices |
Jahrgang | 67 |
Ausgabenummer | 11 |
DOIs | |
Publikationsstatus | Veröffentlicht - Nov. 2020 |
Schlagwörter
- GaN
- power electronics
- HEMPT
- Hot electron
ASJC Scopus subject areas
- Elektronische, optische und magnetische Materialien
- Elektrotechnik und Elektronik