Impact of Power Supply Arrangement on Electromagnetic Emission from ICs

With the advancing development of integrated circuits (ICs), more and more complex functions and higher performance levels can nowadays directly be integrated into a single IC package. In this context, the issue of electromagnetic compatibility (EMC) is becoming more critical, as the higher the integration density, the higher the electromagnetic emissions tend to be. In this paper, an EMC test IC is used to investigate the influence of three different power supply pinouts (arrangements of VDD and GND pins) on the conducted electromagnetic emission of the IC. This is accomplished based on the 150 Ohm measurement technique described in the IEC 61967 standard. A significant difference in electromagnetic emission depending on the power supply pinout is shown, highlighting the importance of careful power supply planning in IC design