Impact of Power Supply Arrangement on Electromagnetic Emission from ICs

B. Deutschmann; N. Juch

doi:10.1109/Austrochip61217.2023.10285159

Impact of Power Supply Arrangement on Electromagnetic Emission from ICs

B. Deutschmann, N. Juch

Institute of Electronics (4390)

Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review

Abstract

With the advancing development of integrated circuits (ICs), more and more complex functions and higher performance levels can nowadays directly be integrated into a single IC package. In this context, the issue of electromagnetic compatibility (EMC) is becoming more critical, as the higher the integration density, the higher the electromagnetic emissions tend to be. In this paper, an EMC test IC is used to investigate the influence of three different power supply pinouts (arrangements of VDD and GND pins) on the conducted electromagnetic emission of the IC. This is accomplished based on the 150 Ohm measurement technique described in the IEC 61967 standard. A significant difference in electromagnetic emission depending on the power supply pinout is shown, highlighting the importance of careful power supply planning in IC design

Original language	English
Title of host publication	2023 Austrochip Workshop on Microelectronics, Austrochip 2023 - Proceedings
Pages	31-34
ISBN (Electronic)	979-8-3503-5785-1
DOIs	https://doi.org/10.1109/Austrochip61217.2023.10285159
Publication status	Published - 2023
Event	2023 Austrochip Workshop on Microelectronics: Austrochip 2023 - Graz, Austria Duration: 20 Sept 2023 → 21 Sept 2023

Workshop

Workshop	2023 Austrochip Workshop on Microelectronics
Abbreviated title	Austrochip 2023
Country/Territory	Austria
City	Graz
Period	20/09/23 → 21/09/23

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10.1109/Austrochip61217.2023.10285159

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title = "Impact of Power Supply Arrangement on Electromagnetic Emission from ICs",

abstract = "With the advancing development of integrated circuits (ICs), more and more complex functions and higher performance levels can nowadays directly be integrated into a single IC package. In this context, the issue of electromagnetic compatibility (EMC) is becoming more critical, as the higher the integration density, the higher the electromagnetic emissions tend to be. In this paper, an EMC test IC is used to investigate the influence of three different power supply pinouts (arrangements of VDD and GND pins) on the conducted electromagnetic emission of the IC. This is accomplished based on the 150 Ohm measurement technique described in the IEC 61967 standard. A significant difference in electromagnetic emission depending on the power supply pinout is shown, highlighting the importance of careful power supply planning in IC design",

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year = "2023",

doi = "10.1109/Austrochip61217.2023.10285159",

language = "English",

pages = "31--34",

booktitle = "2023 Austrochip Workshop on Microelectronics, Austrochip 2023 - Proceedings",

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T1 - Impact of Power Supply Arrangement on Electromagnetic Emission from ICs

AU - Deutschmann, B.

AU - Juch, N.

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N2 - With the advancing development of integrated circuits (ICs), more and more complex functions and higher performance levels can nowadays directly be integrated into a single IC package. In this context, the issue of electromagnetic compatibility (EMC) is becoming more critical, as the higher the integration density, the higher the electromagnetic emissions tend to be. In this paper, an EMC test IC is used to investigate the influence of three different power supply pinouts (arrangements of VDD and GND pins) on the conducted electromagnetic emission of the IC. This is accomplished based on the 150 Ohm measurement technique described in the IEC 61967 standard. A significant difference in electromagnetic emission depending on the power supply pinout is shown, highlighting the importance of careful power supply planning in IC design

AB - With the advancing development of integrated circuits (ICs), more and more complex functions and higher performance levels can nowadays directly be integrated into a single IC package. In this context, the issue of electromagnetic compatibility (EMC) is becoming more critical, as the higher the integration density, the higher the electromagnetic emissions tend to be. In this paper, an EMC test IC is used to investigate the influence of three different power supply pinouts (arrangements of VDD and GND pins) on the conducted electromagnetic emission of the IC. This is accomplished based on the 150 Ohm measurement technique described in the IEC 61967 standard. A significant difference in electromagnetic emission depending on the power supply pinout is shown, highlighting the importance of careful power supply planning in IC design

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U2 - 10.1109/Austrochip61217.2023.10285159

DO - 10.1109/Austrochip61217.2023.10285159

M3 - Conference paper

SP - 31

EP - 34

BT - 2023 Austrochip Workshop on Microelectronics, Austrochip 2023 - Proceedings

T2 - 2023 Austrochip Workshop on Microelectronics

Y2 - 20 September 2023 through 21 September 2023

ER -

Impact of Power Supply Arrangement on Electromagnetic Emission from ICs

Abstract

Workshop

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