Influence of the IC power supply and decoupling capacitor arrangement on the electromagnetic emission

B. Deutschmann; N. Juch

doi:10.1007/s00502-023-01200-x

Influence of the IC power supply and decoupling capacitor arrangement on the electromagnetic emission

Titel in Übersetzung: Einfluss der Anordnung von IC-Stromversorgung mit Stützkondensatoren auf die elektromagnetische Emission

B. Deutschmann^*, N. Juch

^*Korrespondierende/r Autor/-in für diese Arbeit

Institut für Elektronik (4390)

Publikation: Beitrag in einer Fachzeitschrift › Artikel › Begutachtung

Abstract

Mit der fortschreitenden Entwicklung integrierter Schaltkreise (ICs) können heutzutage immer komplexere Funktionen und höhere Leistungsstufen direkt in ein einziges IC-Gehäuse integriert werden. In diesem Zusammenhang wird die Frage der elektromagnetischen Verträglichkeit (EMV) immer kritischer, denn je höher die Integrationsdichte ist, desto höher sind tendenziell auch die elektromagnetischen Emissionen. In diesem Beitrag wird ein EMV Test-IC verwendet, um den Einfluss von verschiedenen Stromversorgungs-Pinouts (Anordnung der VDD- und GND-Pins in Center- und Corner-Konfiguration) auf die elektromagnetische Emission des ICs zu untersuchen. Dies geschieht auf der Grundlage der in der Norm IEC 61967‑3 beschriebenen Surface Scanning-Methode zur Charakterisierung des magnetischen Nahfeldes an der Oberfläche des IC-Gehäuses sowie auf der in der IEC 61967‑4 beschriebenen 150 Ohm-Messmethode zur Bestimmung der leitungsgeführten Störemissionen am Stromversorgungsanschluss des ICs. Bei beiden Messmethoden zeigt sich ein signifikanter Unterschied in der elektromagnetischen Störemission, der auf die Abhängigkeit von der Anordnung der Pinbelegungen der Stromversorgung zurückzuführen ist. Diese Ergebnisse verdeutlichen die Wichtigkeit einer sorgfältigen Planung der Stromversorgung bei der Entwicklung von elektromagnetisch verträglichen ICs.

Titel in Übersetzung	Einfluss der Anordnung von IC-Stromversorgung mit Stützkondensatoren auf die elektromagnetische Emission
Originalsprache	englisch
Seiten (von - bis)	66-75
Seitenumfang	10
Fachzeitschrift	Elektrotechnik und Informationstechnik
Jahrgang	141
Ausgabenummer	1
DOIs	https://doi.org/10.1007/s00502-023-01200-x
Publikationsstatus	Veröffentlicht - März 2024

ASJC Scopus subject areas

Elektrotechnik und Elektronik

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10.1007/s00502-023-01200-xLizenz: CC BY 4.0

s00502-023-01200-xEndgültige, publizierte Fassung, 2,54 MBLizenz: CC BY 4.0

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abstract = "With the advancing development of integrated circuits (ICs), more and more complex functions and higher performance levels can nowadays directly be integrated into a single IC package. In this context, the issue of electromagnetic compatibility (EMC) is becoming more critical, as the higher the integration density, the higher the electromagnetic emissions tend to be. In this paper, an EMC test IC is used to investigate the influence of different power supply pinouts (arrangement of VDD and GND pins in center and corner configuration) on the electromagnetic emission of the IC. This is done on the basis of the surface-scanning technique described in the IEC 61967‑3 standard for characterizing the magnetic near field at the surface of the IC package, and on the basis of the 150 Ohm measurement method described in IEC 61967‑4 for determining the conducted interference emissions at the power supply pinout of the IC. Both measurement methods show a significant difference in electromagnetic emissions due to the dependence on the arrangement of the power supply pinouts. These results highlight the importance of careful power supply design in the development of electromagnetically compatible ICs.",

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AB - With the advancing development of integrated circuits (ICs), more and more complex functions and higher performance levels can nowadays directly be integrated into a single IC package. In this context, the issue of electromagnetic compatibility (EMC) is becoming more critical, as the higher the integration density, the higher the electromagnetic emissions tend to be. In this paper, an EMC test IC is used to investigate the influence of different power supply pinouts (arrangement of VDD and GND pins in center and corner configuration) on the electromagnetic emission of the IC. This is done on the basis of the surface-scanning technique described in the IEC 61967‑3 standard for characterizing the magnetic near field at the surface of the IC package, and on the basis of the 150 Ohm measurement method described in IEC 61967‑4 for determining the conducted interference emissions at the power supply pinout of the IC. Both measurement methods show a significant difference in electromagnetic emissions due to the dependence on the arrangement of the power supply pinouts. These results highlight the importance of careful power supply design in the development of electromagnetically compatible ICs.

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Influence of the IC power supply and decoupling capacitor arrangement on the electromagnetic emission

Abstract

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