@inproceedings{0b18b4ff003547a2879123785d03705c,
title = "Vacuum-assisted selective adhesive imprinting for heterogeneous system integration of MOEMS devices: Automated assembly of miniaturized PM sensor",
abstract = "In this paper we propose the selective adhesive bonding technique using contact imprinting from thin adhesive layers spin-coated on the sacrificial polyethylene foils. The imprinting is assisted with vacuum release of the polymer foil to reduce the pull-off adhesive force and prevent sticking, posing less constraints on the required lifting force. We apply this method in assembly of a highly integrated optical particle counter confronted with several strict assembly requirements, such as selective bonding with small feature size (<200 μm), minimal adhesive thicknesses (<15μm), precise out-of plane tolerances, low adhesive squeeze-out and hermetically sealed packaging. A successful selective adhesive bonding with ratio of vacuum tool area to adhesive contact area of 1:20 was demonstrated.",
keywords = "heterogeneous integration, MEMS, MOEMS, optical particle counter, PM2.5, selective adhesive bonding",
author = "Jaka Pribosek and Markus Zauner and Jochen Bardong and Alfred Binder and Paul Maierhofer and Alexander Bergmann and Georg Rohrer",
year = "2019",
month = oct,
day = "1",
doi = "10.1109/SENSORS43011.2019.8956807",
language = "English",
series = "Proceedings of IEEE Sensors",
publisher = "Institute of Electrical and Electronics Engineers",
booktitle = "2019 IEEE Sensors, SENSORS 2019 - Conference Proceedings",
address = "United States",
note = "18th IEEE Sensors Conference : SENSORS 2019 ; Conference date: 27-10-2019 Through 30-10-2019",
}