Characterization of Moisture Uptake in Microelectronics Packaging Materials

Fabian Huber, Harald Etschmaier, Archim Wolfberger, Anderson Singulani, Peter Hadley

Research output: Chapter in Book/Report/Conference proceedingConference paperpeer-review


Moisture uptake of materials, used in optoelectronic sensor packaging for the purpose of component attach or for encapsulation, is investigated. The diffusion behavior of these mostly epoxide-based polymer compounds is characterized under various temperature and humidity loads and described using analytical models. The water uptake during soak tests was determined and the data can be fit assuming multistep diffusion behavior. It is assumed that this behavior can be assigned to the formation of hydrogen bonds and moisture absorption in the free volume of the polymer matrix [1]. To investigate this assumption further, in addition to gravimetric methods, the evolution of the O-H stretch modes are measured by Attenuated Total Reflection Fourier Transform Infrared Spectroscopy (ATR-FTIR).

Original languageEnglish
Title of host publication2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers
ISBN (Electronic)9781538668139
Publication statusPublished - 26 Nov 2018
Event7th Electronic System-Integration Technology Conference - Dresden, Germany
Duration: 18 Sept 201821 Sept 2018


Conference7th Electronic System-Integration Technology Conference
Abbreviated titleSTC 2018


  • diffusion
  • EMC
  • FEA
  • microelectronics
  • packaging materials
  • reliability
  • spectroscopy

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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