Soft-Failures in Component-Level ESD Testing on the Example of Flip-Flop Data Retention

Patrick Schrey

doi:10.1109/EMCCompo.2019.8919921

Soft-Failures in Component-Level ESD Testing on the Example of Flip-Flop Data Retention

Patrick Schrey

Institute of Electronics (4390)

Research output: Chapter in Book/Report/Conference proceeding › Conference paper › peer-review

Abstract

Electrostatic Discharge immunity is a design challenge for electronic components and systems alike. Unfortunately, component-level Electrostatic Discharge data seldom provides useful information for system design. In order to pick a suitable component to meet the system's Electrostatic Discharge requirements, a more sophisticated characterisation of components with respect to Electrostatic Discharge has to be found. In particular, soft-failures in component-level Electrostatic Discharge testing are required. This paper presents a new soft-failure Electrostatic Discharge characterisation to help system designers.

Original language	English
Title of host publication	2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)
Publisher	IEEE Xplore
Number of pages	3
DOIs	https://doi.org/10.1109/EMCCompo.2019.8919921
Publication status	Published - 21 Oct 2019
Event	The 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits - Zhejiang University, Haining, China Duration: 21 Oct 2019 → 23 Oct 2019 http://www.emcconf.org/

Conference

Conference	The 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits
Abbreviated title	EMC Compo
Country/Territory	China
City	Haining
Period	21/10/19 → 23/10/19
Internet address	http://www.emcconf.org/

Access to Document

10.1109/EMCCompo.2019.8919921

1 Conference or symposium (Participation in/Organisation of)
1 Talk at conference or symposium

The 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits
Patrick Schrey (Participant)
21 Oct 2019 → 23 Oct 2019
Activity: Participation in or organisation of › Conference or symposium (Participation in/Organisation of)
Soft-Failures in Component-Level ESD Testing on the Example of Flip-Flop Data Retention
Patrick Schrey (Speaker)
22 Oct 2019
Activity: Talk or presentation › Talk at conference or symposium › Science to science

Cite this

Schrey, P 2019, Soft-Failures in Component-Level ESD Testing on the Example of Flip-Flop Data Retention. in 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo). IEEE Xplore, The 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, Haining, China, 21/10/19. https://doi.org/10.1109/EMCCompo.2019.8919921

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title = "Soft-Failures in Component-Level ESD Testing on the Example of Flip-Flop Data Retention",

abstract = "Electrostatic Discharge immunity is a design challenge for electronic components and systems alike. Unfortunately, component-level Electrostatic Discharge data seldom provides useful information for system design. In order to pick a suitable component to meet the system's Electrostatic Discharge requirements, a more sophisticated characterisation of components with respect to Electrostatic Discharge has to be found. In particular, soft-failures in component-level Electrostatic Discharge testing are required. This paper presents a new soft-failure Electrostatic Discharge characterisation to help system designers.",

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doi = "10.1109/EMCCompo.2019.8919921",

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N2 - Electrostatic Discharge immunity is a design challenge for electronic components and systems alike. Unfortunately, component-level Electrostatic Discharge data seldom provides useful information for system design. In order to pick a suitable component to meet the system's Electrostatic Discharge requirements, a more sophisticated characterisation of components with respect to Electrostatic Discharge has to be found. In particular, soft-failures in component-level Electrostatic Discharge testing are required. This paper presents a new soft-failure Electrostatic Discharge characterisation to help system designers.

AB - Electrostatic Discharge immunity is a design challenge for electronic components and systems alike. Unfortunately, component-level Electrostatic Discharge data seldom provides useful information for system design. In order to pick a suitable component to meet the system's Electrostatic Discharge requirements, a more sophisticated characterisation of components with respect to Electrostatic Discharge has to be found. In particular, soft-failures in component-level Electrostatic Discharge testing are required. This paper presents a new soft-failure Electrostatic Discharge characterisation to help system designers.

U2 - 10.1109/EMCCompo.2019.8919921

DO - 10.1109/EMCCompo.2019.8919921

M3 - Conference paper

BT - 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)

PB - IEEE Xplore

T2 - The 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits

Y2 - 21 October 2019 through 23 October 2019

ER -

Soft-Failures in Component-Level ESD Testing on the Example of Flip-Flop Data Retention

Abstract

Conference

Access to Document

Activities

The 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits

Soft-Failures in Component-Level ESD Testing on the Example of Flip-Flop Data Retention

Cite this