SPICE Modeling of Process Variation Using Location Depth Corner Models

Gerhard Rappitsch, Ehrenfried Seebacher, Michael Kocher, Ernst Stadlober

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	201-213
Journal	IEEE Transactions on Semiconductor Manufacturing
Volume	17
Issue number	2
DOIs	https://doi.org/10.1109/TSM.2004.826940
Publication status	Published - 2004

Access to Document

@article{b89fb8314b29435aa138d9dc48b6bb64,

title = "SPICE Modeling of Process Variation Using Location Depth Corner Models",

author = "Gerhard Rappitsch and Ehrenfried Seebacher and Michael Kocher and Ernst Stadlober",

year = "2004",

doi = "10.1109/TSM.2004.826940",

language = "English",

volume = "17",

pages = "201--213",

journal = "IEEE Transactions on Semiconductor Manufacturing ",

issn = "1558-2345",

publisher = "Institute of Electrical and Electronics Engineers",

number = "2",

}

TY - JOUR

T1 - SPICE Modeling of Process Variation Using Location Depth Corner Models

AU - Rappitsch, Gerhard

AU - Seebacher, Ehrenfried

AU - Kocher, Michael

AU - Stadlober, Ernst

PY - 2004

Y1 - 2004

U2 - 10.1109/TSM.2004.826940

DO - 10.1109/TSM.2004.826940

M3 - Article

SN - 1558-2345

VL - 17

SP - 201

EP - 213

JO - IEEE Transactions on Semiconductor Manufacturing

JF - IEEE Transactions on Semiconductor Manufacturing

IS - 2

ER -