Telemetric angle sensing using additively manufactured millimeter-wave metamaterial

Michael Töfferl; Alexander Schossmann; Christoph Schmidt; C. Michenthaler; Dirk Hammerschmidt; Alexander Bergmann

doi:10.5162/SMSI2023/P36

Telemetric angle sensing using additively manufactured millimeter-wave metamaterial

Michael Töfferl, Alexander Schossmann, Christoph Schmidt, C. Michenthaler, Dirk Hammerschmidt, Alexander Bergmann

Institut für Elektrische Messtechnik und Sensorik (4530)

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in einem Konferenzband › Begutachtung

Abstract

We present a fully telemetric sensor concept for real-time end-of-shaft angle measurement. It is based on additively manufactured metamaterial consisting of out-of-plane oriented structures. The sensor effect is based on the angle-dependent coupling of linearly polarized electromagnetic waves into the fundamental resonance of the metamaterial. This allows to quantify the rotation angle as a function of the reflection amplitude.

Originalsprache	englisch
Titel	SMSI - Sensor and Measurement Science International
Seiten	350-51
ISBN (elektronisch)	978-3-9819376-8-8
DOIs	https://doi.org/10.5162/SMSI2023/P36
Publikationsstatus	Veröffentlicht - Mai 2023
Veranstaltung	Sensor and Measurement Science International 2023: SMSI 2023 - NürnbergConvention Center NCC West Messezentrum 1, Nürnberg, Deutschland Dauer: 8 Mai 2023 → 11 Mai 2023 https://www.smsi-conference.com

Konferenz

Konferenz	Sensor and Measurement Science International 2023
Kurztitel	SMSI 2023
Land/Gebiet	Deutschland
Ort	Nürnberg
Zeitraum	8/05/23 → 11/05/23
Internetadresse	https://www.smsi-conference.com

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10.5162/SMSI2023/P36

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Töfferl, M , Schossmann, A , Schmidt, C, Michenthaler, C, Hammerschmidt, D & Bergmann, A 2023, Telemetric angle sensing using additively manufactured millimeter-wave metamaterial. in SMSI - Sensor and Measurement Science International. S. 350-51, Sensor and Measurement Science International 2023, Nürnberg, Bayern, Deutschland, 8/05/23. https://doi.org/10.5162/SMSI2023/P36

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title = "Telemetric angle sensing using additively manufactured millimeter-wave metamaterial",

abstract = "We present a fully telemetric sensor concept for real-time end-of-shaft angle measurement. It is based on additively manufactured metamaterial consisting of out-of-plane oriented structures. The sensor effect is based on the angle-dependent coupling of linearly polarized electromagnetic waves into the fundamental resonance of the metamaterial. This allows to quantify the rotation angle as a function of the reflection amplitude.",

author = "Michael T{\"o}fferl and Alexander Schossmann and Christoph Schmidt and C. Michenthaler and Dirk Hammerschmidt and Alexander Bergmann",

year = "2023",

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doi = "10.5162/SMSI2023/P36",

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AU - Michenthaler, C.

AU - Hammerschmidt, Dirk

AU - Bergmann, Alexander

PY - 2023/5

Y1 - 2023/5

N2 - We present a fully telemetric sensor concept for real-time end-of-shaft angle measurement. It is based on additively manufactured metamaterial consisting of out-of-plane oriented structures. The sensor effect is based on the angle-dependent coupling of linearly polarized electromagnetic waves into the fundamental resonance of the metamaterial. This allows to quantify the rotation angle as a function of the reflection amplitude.

AB - We present a fully telemetric sensor concept for real-time end-of-shaft angle measurement. It is based on additively manufactured metamaterial consisting of out-of-plane oriented structures. The sensor effect is based on the angle-dependent coupling of linearly polarized electromagnetic waves into the fundamental resonance of the metamaterial. This allows to quantify the rotation angle as a function of the reflection amplitude.

U2 - 10.5162/SMSI2023/P36

DO - 10.5162/SMSI2023/P36

M3 - Conference paper

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BT - SMSI - Sensor and Measurement Science International

T2 - Sensor and Measurement Science International 2023

Y2 - 8 May 2023 through 11 May 2023

ER -

Telemetric angle sensing using additively manufactured millimeter-wave metamaterial

Abstract

Konferenz

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